IEC 60191-6-18:2010/Cor.1:2010

IEC 60191-6-18:2010/Cor.1:2010

Name in English:
IEC 60191-6-18:2010/Cor.1:2010

Name in Russian:
МЭК 60191-6-18:2010/Попр.1:2010

Description in English:
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA). Corrigendum 1

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-18. Общие правила подготовки габаритных чертежей смонтированных на поверхности корпусов полупроводниковых приборов. Руководство по проектированию корпусов BGA. Поправка 1

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Electronic (PDF)

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Delivery time (for English version):
1 business day

Delivery time (for Russian version):
2 business days


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