IEC 60191-6-18:2010/Cor.2:2010

IEC 60191-6-18:2010/Cor.2:2010

Name in English:
IEC 60191-6-18:2010/Cor.2:2010

Name in Russian:
МЭК 60191-6-18:2010/Попр.2:2010

Description in English:
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA). Corrigendum 2

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-18. Общие правила подготовки габаритных чертежей смонтированных на поверхности корпусов полупроводниковых приборов. Руководство по проектированию корпусов BGA. Поправка 2

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
1

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
2 business days

SKU:
IEC012533

Choose Document Language:
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