IEC 60191-6-18:2010/Cor.2:2010

IEC 60191-6-18:2010/Cor.2:2010

Name in English:
IEC 60191-6-18:2010/Cor.2:2010

Name in Russian:
МЭК 60191-6-18:2010/Попр.2:2010

Description in English:
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA). Corrigendum 2

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-18. Общие правила подготовки габаритных чертежей смонтированных на поверхности корпусов полупроводниковых приборов. Руководство по проектированию корпусов BGA. Поправка 2

Document status:
Active

Format:
Electronic (PDF)

Page count:
1

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
2 business days

SKU:
IEC000912

Choose Document Language:
$8
Need Help?

Customers who bought this item also bought

IEC 60050-471:2007
International Electrotechnical Vocabulary - Part 471: Insulators
$12
IEC 60811-302:2012
Electric and optical fibre cables - Test methods for non-metallic materials - Part 302: Electrical tests - Measurement of the d.c. resistivity at 23 °C and 100 °C of filling compounds
$12
IEC 60335-2-29:2016
Household and similar electrical appliances - Safety - Part 2-29: Particular requirements for battery chargers
$12
IEC 60811-1-2:1985
Common test methods for insulating and sheathing materials of electric cables; part 1: methods for general application; section two: thermal ageing methods
$12
IEC 61010-2-040:2015
Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 2-040: Particular requirements for sterilizers and washer-disinfectors used to treat medical materials
$12
IEC 62386-302:2017
Digital addressable lighting interface - Part 302: Particular requirements - Input devices - Absolute input devices
$12