IEC 60191-6-19:2010

IEC 60191-6-19:2010

Name in English:
IEC 60191-6-19:2010

Name in Russian:
МЭК 60191-6-19:2010

Description in English:
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-19. Методы измерения коробления корпусов при повышенных температурах и максимального допустимого коробления

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
3 business days


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