IEC 60191-6-19:2010

IEC 60191-6-19:2010

Name in English:
IEC 60191-6-19:2010

Name in Russian:
МЭК 60191-6-19:2010

Description in English:
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-19. Методы измерения коробления корпусов при повышенных температурах и максимального допустимого коробления

Document status:
Active

Format:
Electronic (PDF)

Page count:
30

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
3 business days

SKU:
IEC000913

Choose Document Language:
$12
Need Help?

Customers who bought this item also bought

IEC 61196-1-103:2015
Coaxial communication cables - Part 1-103: Electrical test methods - Test for capacitance of cable
$8
IEC 61300-2-8:1995
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-8: Tests - Bump
$12
IEC 60519-21:2008
Safety in electroheat installations - Part 21: Particular requirements for resistance heating equipment - Heating and melting glass equipment
$12
IEC 60398:2015
Installations for electroheating and electromagnetic processing - General performance test methods
$12
IEC 62054-11:2004/Amd.1:2016/Cor.1:2018
Electricity metering (A.C.) - Tariff and load control - Part 11: Particular requirements for electronic ripple control receivers. Amendment 1. Corrigendum 1
$8
IEC 60050-701:1988/Amd.1:2016
International electrotechnical vocabulary - Part 701: Telecommunications, channels and networks. Amendment 1
$12