IEC 60191-6:2009

IEC 60191-6:2009

Name in English:
IEC 60191-6:2009

Name in Russian:
МЭК 60191-6:2009

Description in English:
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6. Общие правила составления габаритных чертежей для монтажа корпусов полупроводниковых приборов

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
8 business days


Choose Document Language:
Need Help?

Customers who bought this item also bought

IEC 61007:1994
Transformers and inductors for use in electronic and telecommunication equipment - Measuring methods and test procedures
CISPR 18-3:1986/Amd.1:1996
Radio interference characteristics of overhead power lines and high-voltage equipment - Part 3: Code of practice for minimizing the generation of radio noise; Amendment 1
IEC 60512-1-100:2012
Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications
IEC/PAS 60092-510:2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
IEC 62104:2015
Characteristics of DAB receivers
IEC/TS 61094-7:2006
Measurement microphones - Part 7: Values for the difference between free-field and pressure sensitivity levels of laboratory standard microphones