IEC 60191-6-21:2010

IEC 60191-6-21:2010

Name in English:
IEC 60191-6-21:2010

Name in Russian:
МЭК 60191-6-21:2010

Description in English:
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-21. Общие правила составления габаритных чертежей для поверхностно монтируемых корпусов полупроводниковых приборов. Методы измерения размеров корпусов малых габаритов

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
4 business days


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