IEC 60191-6-21:2010

IEC 60191-6-21:2010

Name in English:
IEC 60191-6-21:2010

Name in Russian:
МЭК 60191-6-21:2010

Description in English:
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-21. Общие правила составления габаритных чертежей для поверхностно монтируемых корпусов полупроводниковых приборов. Методы измерения размеров корпусов малых габаритов

Document status:
Active

Format:
Electronic (PDF)

Page count:
32

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
4 business days

SKU:
IEC000917

Choose Document Language:
$12
Need Help?

Customers who bought this item also bought

IEC 63093-6:2018
Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 6: ETD-cores for use in power supplies
$12
IEC 61508-3:2010
Functional safety of electrical/electronic/programmable electronic safety-related systems - Part 3: Software requirements
$15
IEC 61205:1993
Ultrasonics; dental descaler systems; measurement and declaration of the output characteristics
$12
IEC 61786-2:2014
Measurement of DC magnetic, AC magnetic and AC electric fields from 1 Hz to 100 kHz with regard to exposure of human beings - Part 2: Basic standard for measurements
$12
IEC/TR 62357:2003
Power system control and associated communications - Reference architecture for object models, services and protocols
$12
IEC 60364-7-702:2010
Low-voltage electrical installations - Part 7-702: Requirements for special installations or locations - Swimming pools and fountains
$12