IEC 60191-6-22:2012

IEC 60191-6-22:2012

Name in English:
IEC 60191-6-22:2012

Name in Russian:
МЭК 60191-6-22:2012

Description in English:
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-22. Общие правила составления габаритных чертежей для поверхностно монтируемых корпусов полупроводниковых приборов. Руководство по проектированию силиконовых полупроводниковых корпусов с малым шагом типа "массив шариков" и с матрицей контактных площадок (S-FBGA и S-FLGA)

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
38

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
4 business days

SKU:
IEC013971

Choose Document Language:
$15
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