IEC 60191-6-3:2000

IEC 60191-6-3:2000

Name in English:
IEC 60191-6-3:2000

Name in Russian:
МЭК 60191-6-3:2000

Description in English:
Mechanical standardization of semiconductor devices. Part 6-3. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-3. Общие правила составления габаритных чертежей для поверхностного монтажа корпусов полупроводниковых приборов. Методы измерения размеров плоских корпусов с четырьмя копланарными выводами

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
34

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
4 business days

SKU:
IEC015852

Choose Document Language:
$15
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