IEC 60191-6-4:2003

IEC 60191-6-4:2003

Name in English:
IEC 60191-6-4:2003

Name in Russian:
МЭК 60191-6-4:2003

Description in English:
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-4. Общие правила для составления габаритных чертежей для наружного монтажа корпусов полупроводниковых приборов. Методы измерения размеров шариковых матричных корпусов (BGA)

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
36

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
4 business days

SKU:
IEC014005

Choose Document Language:
$15
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