IEC 60191-6-8:2001

IEC 60191-6-8:2001

Name in English:
IEC 60191-6-8:2001

Name in Russian:
МЭК 60191-6-8:2001

Description in English:
Mechanical standardization of semiconductor devices. Part 6-8. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-8. Общие правила для составления габаритных чертежей для монтажа корпусов полупроводниковых приборов. Руководство по проектированию керамических плоских корпусов с четырьмя копланарными выводами и с герметизацией стеклом (G-QFP)

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
22

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
3 business days

SKU:
IEC015846

Choose Document Language:
$50
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