IEC 60749-15:2010

IEC 60749-15:2010

Name in English:
IEC 60749-15:2010

Name in Russian:
МЭК 60749-15:2010

Description in English:
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Description in Russian:
Приборы полупроводниковые. Методы механических и климатических испытаний. Часть 15. Стойкость к температуре пайки при штырьковом монтаже приборов

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
2 business days


Choose Document Language:
Need Help?

Customers who bought this item also bought

IEC 60050-601:1985
International Electrotechnical Vocabulary. Part 601 : Chapter 601 : Generation, transmission and distribution of electricity - General
IEC/TR 61000-2-14:2006
Electromagnetic compatibility (EMC) - Part 2-14: Environment - Overvoltages on public electricity distribution networks
IEC 60107-2:1997
Methods of measurement on receivers for television broadcast transmissions - Part 2: Audio channels - General methods and methods for monophonic channels
IEC 61784-5-19:2013
Industrial communication networks - Profiles - Part 5-19: Installation of fieldbuses - Installation profiles for CPF 19
IEC 62693:2013
Industrial electroheating installations - Test methods for infrared electroheating installations
IEC 61360-6:2016
Standard data element types with associated classification scheme for electric components - Part 6: IEC Common Data Dictionary (IEC CDD) quality guidelines