IEC 60749-20-1:2009

IEC 60749-20-1:2009

Name in English:
IEC 60749-20-1:2009

Name in Russian:
МЭК 60749-20-1:2009

Description in English:
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Description in Russian:
Приборы полупроводниковые. Методы механических и климатических испытаний. Часть 20-1. Обращение, упаковка, этикетирование и отгрузка поверхностно монтируемых устройств чувствительных к совместному воздействию влажности и теплоты, выделяемой при пайке

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
7 business days


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