IEC 60749-20:2008

IEC 60749-20:2008

Name in English:
IEC 60749-20:2008

Name in Russian:
МЭК 60749-20:2008

Description in English:
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Description in Russian:
Приборы полупроводниковые. Методы механических и климатических испытаний. Часть 20. Сопротивление поверхностно монтируемых устройств в пластмассовом корпусе совместному воздействию влажности и теплоты, выделяемой при пайке

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
6 business days


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