IEC 60749-21:2011

IEC 60749-21:2011

Name in English:
IEC 60749-21:2011

Name in Russian:
МЭК 60749-21:2011

Description in English:
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Description in Russian:
Приборы полупроводниковые. Методы механических и климатических испытаний. Часть 21. Способность подвергаться пайке

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
5 business days


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