IEC 61189-5-2:2015

IEC 61189-5-2:2015

Name in English:
IEC 61189-5-2:2015

Name in Russian:
МЭК 61189-5-2:2015

Description in English:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Description in Russian:
Материалы электрические, печатные платы и другие структуры межсоединений и узлов. Методы испытаний. Часть 5-2. Общие методы испытаний материалов и узлов. Флюс для пайки мягким припоем узлов печатных плат

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
88

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
9 business days

SKU:
IEC015482

Choose Document Language:
$15
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