IEC 61189-5-4:2015

IEC 61189-5-4:2015

Name in English:
IEC 61189-5-4:2015

Name in Russian:
МЭК 61189-5-4:2015

Description in English:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Description in Russian:
Материалы электрические, печатные платы и другие структуры межсоединений и узлов. Методы испытаний. Часть 5-4. Общие методы испытаний материалов и узлов. Мягкие припои и проволочный припой с флюсом и без флюса для пайки узлов печатных плат

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
5 business days


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