IEC 61190-1-2:2014

IEC 61190-1-2:2014

Name in English:
IEC 61190-1-2:2014

Name in Russian:
МЭК 61190-1-2:2014

Description in English:
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Description in Russian:
Материалы креплений для электронных сборок. Часть 1-2. Требования к паяльным пастам для высококачественных межсоединений в электронных сборках

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
50

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
5 business days

SKU:
IEC015008

Choose Document Language:
$15
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