Name in English:
IEC 61190-1-2:2014
Name in Russian:
МЭК 61190-1-2:2014
Description in English:
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Description in Russian:
Материалы креплений для электронных сборок. Часть 1-2. Требования к паяльным пастам для высококачественных межсоединений в электронных сборках
Document status:
Active
Format:
Electronic (pdf/doc)
Page count:
50
Delivery time (for English version):
1 business day
Delivery time (for Russian version):
5 business days
SKU:
IEC015008
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