IEC 61190-1-3:2007

IEC 61190-1-3:2007

Name in English:
IEC 61190-1-3:2007

Name in Russian:
МЭК 61190-1-3:2007

Description in English:
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Description in Russian:
Материалы креплений для электронных сборок. Часть 1-3. Требования к сплавам для припоев электронного назначения и припоям для пайки в электронике под флюсом или без флюса

Document status:
Replaced

Format:
Electronic (pdf/doc)

Page count:
76

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
8 business days

SKU:
IEC010577

Choose Document Language:
$15
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