IEC 62047-18:2013

IEC 62047-18:2013

Name in English:
IEC 62047-18:2013

Name in Russian:
МЭК 62047-18:2013

Description in English:
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Description in Russian:
Приборы полупроводниковые. Микроэлектромеханические приборы. Часть 18. Метод испытания на изгиб тонкопленочных материалов

Document status:
Active

Format:
Electronic (pdf/doc)

Page count:
30

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
3 business days

SKU:
IEC014684

Choose Document Language:
$15
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