IEC 62047-9:2011/Cor.1:2012

IEC 62047-9:2011/Cor.1:2012

Name in English:
IEC 62047-9:2011/Cor.1:2012

Name in Russian:
МЭК 62047-9:2011/Попр.1:2012

Description in English:
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS. Corrigendum 1

Description in Russian:
Приборы полупроводниковые. Микро-электромеханические приборы. Часть 9. Измерение прочности межпластинчатого соединения для MEMS. Поправка 1

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Electronic (PDF)

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Delivery time (for English version):
1 business day

Delivery time (for Russian version):
2 business days


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