IEC 62047-9:2011

IEC 62047-9:2011

Name in English:
IEC 62047-9:2011

Name in Russian:
МЭК 62047-9:2011

Description in English:
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Description in Russian:
Приборы полупроводниковые. Микро-электромеханические приборы. Часть 9. Измерение прочности межпластинчатого соединения для MEMS

Document status:

Electronic (PDF)

Page count:

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
6 business days


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