IEC/PAS 60191-6-18:2008

IEC/PAS 60191-6-18:2008

Name in English:
IEC/PAS 60191-6-18:2008

Name in Russian:
МЭК/PAS 60191-6-18:2008

Description in English:
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-18. Общие правила подготовки габаритных чертежей смонтированных на поверхности пакетов полупроводниковых приборов. Руководство по проектированию BGA

Document status:
Replaced

Format:
Electronic (pdf/doc)

Page count:
24

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
3 business days

SKU:
IEC009375

Choose Document Language:
$15
Need Help?

Customers who bought this item also bought

IEC 60966-4:1992
Radio frequency and coaxial cable assemblies; part 4: sectional specification for semi-rigid coaxial cable assemblies

Regular Price: $50

Special Price $15

IEC 61584:2001
Radiation protection instrumentation. Installed, portable or transportable assemblies. Measurements of air kerma direction and air kerma rate

Regular Price: $50

Special Price $15

IEC 60876-1:2001
Fibre optic spatial switches. Part 1. Generic specification

Regular Price: $50

Special Price $15

IEC 61468:2000/Amd.1:2003
Nuclear power plants - In-core instrumentation - Characteristics and test methods of self-powered neutron detectors. Amendment 1

Regular Price: $50

Special Price $15

IEC 60529:1989/Amd.1:1999
Degrees of protection provided by enclosures (IP code)

Regular Price: $50

Special Price $15

IEC 60811-411:2012
Electric and optical fibre cables - Test methods for non-metallic materials - Part 411: Miscellaneous tests - Low-temperature brittleness of filling compounds

Regular Price: $50

Special Price $15