IEC/PAS 60191-6-19:2008

IEC/PAS 60191-6-19:2008

Name in English:
IEC/PAS 60191-6-19:2008

Name in Russian:
МЭК/PAS 60191-6-19:2008

Description in English:
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

Description in Russian:
Стандартизация конструкций полупроводниковых приборов. Часть 6-19. Методы измерений коробления корпуса при повышенной температуре и максимально допустимое коробление

Document status:
Replaced

Format:
Electronic (pdf/doc)

Page count:
26

Delivery time (for English version):
1 business day

Delivery time (for Russian version):
3 business days

SKU:
IEC009577

Choose Document Language:
$15
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