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Printed boards and assemblies. Design and use. Attachment (land/joint) considerations - Chip carriers with J-leads on four sides. Original standard BS EN 61188-5-6-2003 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies. Design and use - Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA). Original standard BS EN 61188-5-8-2008 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies. Design and use - Electronic component zero orientation for CAD library construction. Original standard BS EN 61188-7-2017 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Measurement of melting temperature or melting temperature ranges of solder alloys. Original standard BS EN 61189-11-2013 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Original standard BS EN 61189-2-2006 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz). Original standard BS EN 61189-2-719-2016 in PDF full version. Additional info + preview on request

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