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Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic bending test. Original standard BS EN 62137-1-4-2009 in PDF full version. Additional info + preview on request

Document status: Active

Surface mounting technology. Environmental and endurance test methods for surface mount solder joints - Mechanical shear fatigue test. Original standard BS EN 62137-1-5-2009 in PDF full version. Additional info + preview on request

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Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN. Original standard BS EN 62137-2004 (2005) in PDF full version. Additional info + preview on request

Document status: Withdrawn

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints. Original standard BS EN 62137-3-2012 in PDF full version. Additional info + preview on request

Document status: Active

Electronics assembly technology - Endurance test methods for solder joint of area array type package surface mount devices. Original standard BS EN 62137-4-2014 (2015) in PDF full version. Additional info + preview on request

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Helical-scan digital video cassette recording format using 12,65mm magnetic tape and incorporating MPEG-4 compression. Type D-16 format. Original standard BS EN 62141-2006 in PDF full version. Additional info + preview on request

Document status: Active