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Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT). Original standard BS EN IEC 61188-6-3-2025 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies. Design and use - Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design. Original standard BS EN IEC 61188-6-4-2019 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials. Original standard BS EN IEC 61189-2-501-2022 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning. Original standard BS EN IEC 61189-2-630-2018 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Detection of defects in interconnection structures by measurement of capacitance. Original standard BS EN IEC 61189-2-720-2024 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials. Original standard BS EN IEC 61189-2-801-2023 in PDF full version. Additional info + preview on request

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