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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for Z-axis expansion of base materials and printed boards. Original standard BS EN IEC 61189-2-803-2023 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300. Original standard BS EN IEC 61189-2-804-2023 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - X/Y CTE test for thin base materials by TMA. Original standard BS EN IEC 61189-2-805-2024 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA. Original standard BS EN IEC 61189-2-807-2021 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Thermal resistance of an assembly by thermal transient method. Original standard BS EN IEC 61189-2-808-2024 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA. Original standard BS EN IEC 61189-2-809-2025 in PDF full version. Additional info + preview on request
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