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Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT). Original standard BS IEC 62047-27-2017 in PDF full version. Additional info + preview on request

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Semiconductor devices. Micro-electromechanical devices - Performance testing method of vibration-driven MEMS electret energy harvesting devices. Original standard BS IEC 62047-28-2017 in PDF full version. Additional info + preview on request

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Semiconductor devices. Micro-electromechanical devices - Electromechanical relaxation test method for freestanding conductive thin-films under room temperature. Original standard BS IEC 62047-29-2017 in PDF full version. Additional info + preview on request

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Semiconductor devices. Micro-electromechanical devices - Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film. Original standard BS IEC 62047-30-2017 in PDF full version. Additional info + preview on request

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Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials. Original standard BS IEC 62047-31-2019 in PDF full version. Additional info + preview on request

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Semiconductor devices. Micro-electromechanical devices - Test method for the nonlinear vibration of MEMS resonators. Original standard BS IEC 62047-32-2019 in PDF full version. Additional info + preview on request

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