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Workmanship requirements for soldered electronic assemblies. Part 3. Through-hole mount assemblies
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Electromagnetic compatibility of technical means. Throttles for interference suppression. General specifications
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Electromagnetic compatibility of technical means. Throttles for interference suppression. General specifications
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Information technology. International standardized. Profiles TB, TC, TD and TE. Connection-mode transport service over connection-mode network service. Part 5. Definition of profiles TB1111/TB1121
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Information technology. Biometrics. BioAPI Interworking protocol
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