ASTM F375-20 PDF
Name in English:
St ASTM F375-20
Name in Russian:
Ст ASTM F375-20
Original standard ASTM F375-20 in PDF full version. Additional info + preview on request
Full title and description
ASTM F375-20 — Standard Specification for Integrated Circuit Lead Frame Material. Specifies requirements for metal strip used to fabricate integrated-circuit lead frames by stamping or photochemical milling, covering applicable metals, required material properties, surface finish, inclusion limits, coil size and physical test requirements.
Abstract
This specification defines the special requirements for metal strip intended for fabrication into integrated circuit lead frames. It applies to copper and copper alloys, ferrous and nickel-based alloys, molybdenum and other metallic materials when used for lead frames. The standard references relevant ASTM material specifications, sets mechanical and dimensional requirements, and prescribes tests for straightness, flatness, coil set and grain size as well as limits on inclusions and surface finish suitable for stamping or photochemical milling.
General information
- Status: Withdrawn (record updated November 30, 2023).
- Publication date: September 1, 2020 (designation F375-20).
- Publisher: ASTM International.
- ICS / categories: 31.240 — Mechanical structures for electronic equipment (electronics packaging / leadframe materials).
- Edition / version: F375-20 (2020 edition).
- Number of pages: 3 pages (concise specification sheet).
Scope
This specification covers special requirements for metal strip used to fabricate integrated-circuit lead frames by stamping or by photochemical milling. Applicable metals include copper and copper alloys, ferrous alloys containing nickel/cobalt/chromium, nickel and nickel alloys, molybdenum and other metallic materials agreed between parties. General chemical, physical and mechanical property requirements are handled by referenced ASTM material specifications; this document supplements those with lead-frame-specific requirements, dimensional and surface criteria, and test methods.
Key topics and requirements
- Applicable materials: copper and copper alloys, nickel/iron-based alloys, molybdenum and other agreed metals suitable for lead frames.
- Conformance to chemical, physical and mechanical property limits from the appropriate ASTM material specifications (referenced within the document).
- Limits on the severity and number of inclusions and requirements for surface finish compatible with stamping or photochemical milling.
- Dimensional control: thickness, width, length tolerances and coil size requirements for coil or length furnishings.
- Physical tests and acceptance criteria: straightness, flatness, coil set and grain-size determinations.
- Ordering information and certification/test report requirements to be specified at purchase (quantity, material designation, temper, dimensions, how furnished, testing and packing/marking).
- Cross-references to other ASTM specifications used for material-specific properties (examples include B103/B103M, B122/B122M, B152/B152M and related F-series electronics documents).
Typical use and users
Used by semiconductor packaging engineers, integrated circuit (IC) leadframe manufacturers, metal strip suppliers, quality and procurement teams in electronics manufacturing, and design/specification engineers specifying leadframe raw material for stamping or photochemical milling processes. Also used by test laboratories and inspectors for incoming-material acceptance of leadframe stock.
Related standards
References and is intended to be used with material-specific ASTM specifications such as ASTM B103/B103M, B122/B122M, B152/B152M and other ASTM F-series documents on electronic materials and packaging. It sits under the jurisdiction of ASTM Committee F01 (Electronics) and is related to other ASTM standards governing metal alloys, plating and processing used in microelectronic packaging.
Keywords
integrated circuit, lead frame, leadframe material, metal strip, copper alloys, nickel alloys, molybdenum, stamping, photochemical milling, surface finish, straightness, flatness, coil set, grain size
FAQ
Q: What is this standard?
A: ASTM F375-20 is the ASTM specification that sets special requirements for metal strip intended for fabrication into integrated circuit lead frames, addressing material types, surface and dimensional requirements, and relevant tests for acceptability.
Q: What does it cover?
A: It covers which metals are acceptable for lead-frame stock, required conformance to chemical/physical/mechanical properties (by reference to other ASTM material specs), limits on inclusions and surface finish, dimensional and coil requirements, and tests such as straightness, flatness, coil set and grain size.
Q: Who typically uses it?
A: IC packaging engineers, leadframe manufacturers and metal suppliers, procurement and quality engineers in semiconductor and electronics assembly operations, and testing/inspection laboratories.
Q: Is it current or superseded?
A: The 2020 edition (F375-20) was published September 1, 2020. According to ASTM records the document was withdrawn in 2023 (ASTM store listing updated November 30, 2023) and is shown as withdrawn with no direct replacement listed.
Q: Is it part of a series?
A: The document is part of the ASTM F-series covering electronics and electronic packaging under Committee F01. F375 is the designation that has been maintained through earlier editions; the 2020 edition is the most recent published edition prior to withdrawal.
Q: What are the key keywords?
A: Integrated circuit, lead frame, leadframe material, metal strip, copper alloy, nickel alloy, molybdenum, stamping, photochemical milling, surface finish.