ASTM F458-13 (2018) PDF

Full title and description

Designation: ASTM F458‑13(2018) — Standard Practice for Nondestructive Pull Testing of Wire Bonds. This practice specifies a nondestructive pull-test procedure for screening individual wire bonds (gold and aluminum) used in microelectronic and hybrid packages. It defines when and how to apply a nondestructive pull force based on destructive-test data, and gives criteria and limitations for use as a quality‑screening method.

Abstract

ASTM F458 describes a nondestructive pull test intended to reveal weak or nonadherent wire bonds while avoiding damage to acceptable bonds. The practice is applicable to small‑diameter wire bonds (approximately 0.0007 to 0.003 in. / 18 to 76 µm) produced by ultrasonic, thermosonic or thermal compression methods. The nondestructive pull level is established from a prior destructive pull-test dataset and may be used for screening if statistical variability of destructive pulls meets specified limits.

General information

• Status: Withdrawn (ASTM record updated November 30, 2023; withdrawn without replacement).
• Publication date: Current edition approved March 1, 2018 (designation F458‑13 reapproved 2018); previous revision edition: 2013; original adoption historically earlier (earlier versions existed).
• Publisher: ASTM International.
• ICS / categories: 29.120.20 (Connecting devices); Electronics standards (Committee F01).
• Edition / version: F458‑13(2018) (Reapproved 2018).
• Number of pages: 3 pages (published form).

Scope

This practice covers nondestructive pull testing of individual wire bonds made by ultrasonic, thermal compression or thermosonic techniques where loop geometry allows a pulling hook. It applies to small‑diameter wires typically used in integrated circuits, hybrid microcircuits and system‑in‑package assemblies (approx. 0.0007–0.003 in. / 18–76 µm). Criteria in the practice are provided for gold and aluminum wire. The nondestructive pull level is established from destructive pull-test results on like bonds and may be used only when the destructive-test sample standard deviation meets the specified acceptance criterion.

Key topics and requirements

• Definition of a nondestructive pull test procedure for wire bonds (hook placement, pulling direction and test timing).
• Applicability to ultrasonic, thermosonic and thermal‑compression bond types and to wire diameters 0.0007–0.003 in. (18–76 µm).
• Requirement that destructive pull tests be performed on a sample (typically ≥25 bonds) to determine mean pull strength and standard deviation before establishing nondestructive pull levels.
• Statistical criterion: nondestructive procedure may be used only if sample standard deviation s ≤ 0.25·x̄ (where x̄ is the sample mean from destructive pulls); otherwise the process is considered out of control and corrective action is required.
• Instructions on when to perform the nondestructive pull test (after bonding and before any further treatment or screening) and limitations (does not prevent failures induced after testing).
• Units: inch‑pound units are primary; SI conversions given for information only.
• Scope limitations and safety/responsibility notes (users must establish applicable safety and regulatory practices).

Typical use and users

This practice is used by semiconductor assembly and packaging laboratories, process and quality engineers in microelectronics manufacturing, contract test laboratories, and reliability/qualification teams that need a nondestructive screening method for wire‑bond quality. Typical applications include in‑line process control, lot screening prior to further processing, and root‑cause analysis when bonding process variability is suspected.

Related standards

Related documents commonly referenced with F458 include ASTM F459 (Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds — destructive pull methods), ASTM F1269 (destructive shear testing of ball bonds), and MIL‑STD‑883 Method 2023 (electronic microcircuit bond testing methods). F458 was developed under ASTM Committee F01 (Electronics) and sits alongside other wire‑bond and bond‑test standards used for process control and qualification.

Keywords

nondestructive pull test, wire bond, thermosonic, ultrasonic, thermal compression, pull strength, microelectronic wire bonds, gold wire, aluminum wire, process control, screening, ASTM F458, destructive pull test, F459.

FAQ

Q: What is this standard?

A: ASTM F458‑13(2018) is a practice that defines a nondestructive pull‑test procedure for screening individual wire bonds used in microelectronics to identify weak or nonadherent bonds without damaging acceptable bonds.

Q: What does it cover?

A: It covers nondestructive pull testing of individual wire bonds made by ultrasonic, thermosonic or thermal compression methods for small‑diameter wire (about 0.0007–0.003 in. / 18–76 µm). It sets how to determine a safe nondestructive pull force from destructive pull‑test statistics and lists applicability, limitations and test timing.

Q: Who typically uses it?

A: Semiconductor and microelectronics assembly and test engineers, quality and process control personnel, contract test labs, and reliability engineers use the practice for in‑line screening and process monitoring.

Q: Is it current or superseded?

A: This designation F458‑13(2018) was withdrawn in November 2023 (ASTM's records show the standard was withdrawn with no replacement). The last reapproval cycle occurred in 2018 (current edition approved March 1, 2018). Users should consult ASTM or their compliance office for the latest status and any applicable replacement guidance.

Q: Is it part of a series?

A: Yes — it is part of the ASTM F01 electronics group of standards covering wire bonds and related tests. It is complementary to ASTM F459 (destructive pull‑test methods) and other bond‑test standards such as F1269 (shear tests) and relevant military or industry test methods (for example MIL‑STD‑883 Method 2023).

Q: What are the key keywords?

A: Nondestructive pull test, wire bond, pull strength, thermosonic, ultrasonic, gold wire, aluminum wire, process control, screening, ASTM F458, microelectronics.