IEC 61967-1-2018 PDF

Full title and description

Integrated circuits — Measurement of electromagnetic emissions — Part 1: General conditions and definitions. This part of IEC 61967 defines the general measurement conditions, test equipment, set-up, procedures and reporting requirements used when characterizing conducted and radiated electromagnetic disturbances from integrated circuits (ICs). It establishes uniform test conditions and identifies critical parameters that influence measurement results so that IC emissions can be quantified and compared.

Abstract

IEC 61967-1:2018 provides definitions, ambient and test conditions, recommended measurement instrumentation and configuration, and the content required in test reports for IC electromagnetic‑emission measurements. It is intended as the general/reference part of the IEC 61967 series and supports the more specific measurement methods given in the other parts of the series. Notable editorial/technical updates in this edition include changes to the described frequency steps above 1 GHz and relocation of the general test board description to an annex.

General information

• Status: Published — International Standard (current edition).
• Publication date: 12 December 2018.
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.200 (Integrated circuits; Electromagnetic compatibility).
• Edition / version: Edition 2.0 (2018).
• Number of pages: 51 pages.

Key bibliographic details above are taken from the IEC publication record for IEC 61967-1:2018.

Scope

This part describes the general conditions and definitions that apply when measuring the conducted and radiated electromagnetic emissions of integrated circuits under controlled conditions. It specifies ambient conditions, stability requirements, measurement instrumentation and bandwidth requirements, recommended test set-ups (including test circuit boards and IC pin loading), and the information to be recorded in test reports. The applicable frequency ranges for measurements are identified in the individual parts of the IEC 61967 series.

Key topics and requirements

• Definitions and terminology for IC emission measurement and reporting.
• Ambient and test conditions (temperature, ambient RF noise level, IC stability over time) required for repeatable measurements.
• Requirements for test equipment: measuring receivers, spectrum analysers, RBW/VBW settings, preamplifiers/attenuators and calibration verification.
• Detailed test set-up guidance: shielded rooms vs. non‑shielded set-ups, test circuit board description, IC pin loading and connections.
• Test procedures and guidance on measurement types (conducted and radiated) and detector/sweep settings; requirements for documenting deviations and test report contents.
• Informative annexes including test-method comparison tables and a general test board description (moved to an annex in this edition).

The clauses and annexes of IEC 61967-1 provide the normative basis for many of the specific IC measurement methods found in the other parts of the IEC 61967 series.

Typical use and users

This standard is used by semiconductor manufacturers, EMC test laboratories, IC characterization teams, hardware design engineers and compliance/qualification groups who need repeatable and comparable measurements of IC electromagnetic emissions. It is referenced by developers of IC‑level EMC test methods and by national and regional standards bodies and test houses when specifying IC emission measurement procedures.

Related standards

IEC 61967-1 is the general/reference part of the IEC 61967 series. Related parts include (examples): Part 2 (TEM‑cell radiated method), Part 3 (surface scan / loop probe methods), Part 4 (1 Ω / 150 Ω direct coupling), Part 5 (workbench Faraday cage), Part 6 (magnetic probe), and Part 8 (IC stripline radiated method — updated in 2023). Users should consult the applicable part for the specific measurement method they intend to use.

Keywords

Integrated circuits; IC; electromagnetic emissions; EMC; conducted emissions; radiated emissions; test circuit board; TEM cell; stripline; magnetic probe; spectrum analyser; measuring receiver; test report; IC emissions.

FAQ

Q: What is this standard?

A: IEC 61967-1:2018 is Part 1 (general conditions and definitions) of the IEC 61967 series that sets out the common conditions, equipment and reporting requirements for measuring electromagnetic emissions from integrated circuits.

Q: What does it cover?

A: It covers ambient/test conditions, stability and repeatability requirements, recommended measurement instrumentation and settings, test set-ups (including test circuit board guidance), procedural notes and the required contents of measurement reports; it does not replace the method‑specific parts of the series but provides the general framework they rely on.

Q: Who typically uses it?

A: Semiconductor/IC manufacturers, EMC test laboratories, IC design and validation engineers, and compliance teams use this standard to assess and document IC emission characteristics and to ensure consistent, comparable measurements.

Q: Is it current or superseded?

A: The edition published on 12 December 2018 (Edition 2.0) is the current IEC edition; the IEC record shows the publication as active with a stability date noted on the IEC record. Users should check the IEC publication record for any amendments or later editions before relying on the standard for the most recent regulatory or normative updates.

Q: Is it part of a series?

A: Yes — IEC 61967 is a multipart series addressing IC electromagnetic emission measurements; IEC 61967-1 is the general/reference part and other parts define specific measurement methods (TEM cell, stripline, magnetic probe, direct coupling, etc.).

Q: What are the key keywords?

A: Integrated circuits, electromagnetic emissions, EMC testing, conducted emissions, radiated emissions, test circuit board, measurement procedures, measuring receiver, spectrum analyser.