IEC 63011-2-2018 PDF

Full title and description

IEC 63011-2:2018 — Integrated circuits — Three dimensional integrated circuits — Part 2: Alignment of stacked dies having fine pitch interconnect. This international standard specifies initial alignment and alignment-maintenance requirements between multiple stacked integrated-circuit dies during the die-bonding process, where the electrical coupling method of die-to-die alignment is used.

Abstract

IEC 63011-2:2018 provides specifications of alignment keys and operating procedures for achieving and maintaining precise alignment of stacked dies with fine-pitch interconnects during die stacking. The document applies specifically to electrical coupling methods used for die-to-die alignment and defines the alignment tolerances and procedural controls required to support reliable 3D integrated circuit assembly.

General information

• Status: Published / Current (base international publication).
• Publication date: 28 November 2018 (base IEC publication).
• Publisher: International Electrotechnical Commission (IEC), TC 47/SC 47A.
• ICS / categories: 31.200 — Integrated circuits.
• Edition / version: Edition 1.0 (2018).
• Number of pages: 28 pages (base IEC publication).

Scope

This standard specifies the alignment keys, measurement references and operating procedures for initial alignment and alignment maintenance between multiple stacked integrated-circuit dies during the die-bonding process. It is limited to cases where an electrical coupling method is used for die-to-die alignment and addresses requirements needed to support fine-pitch interconnects in 3D IC assemblies. It does not replace more general requirements given in Part 1 (general conditions and definitions) but complements them with alignment-specific specifications.

Key topics and requirements

• Definition of alignment keys and reference features used for die-to-die alignment.
• Procedural steps for initial alignment during die bonding to ensure proper placement of stacked dies.
• Requirements for alignment maintenance during subsequent handling and processing to preserve fine-pitch interconnect integrity.
• Tolerancing and accuracy levels appropriate for fine-pitch interconnects in three-dimensional integrated circuits.
• Applicability limited to electrical coupling alignment methods (specifies when the standard applies and when alternative methods are out of scope).

Typical use and users

Used by IC package designers, process engineers, assembly and test houses, equipment manufacturers (die bonder and alignment-tool vendors), quality managers and standards committees involved in 3D IC assembly. It is intended to guide development of assembly processes, procurement specifications for alignment equipment, and internal process-control documents where die stacking with fine-pitch interconnects is performed.

Related standards

IEC 63011-1 (General conditions and definitions) and IEC 63011-3 (other parts in the series) are directly related and provide complementary requirements and test methods. National adoptions/identical publications include BS IEC 63011-2:2018 (identical UK adoption) and various EN/OVE national drafts or adoptions associated with the EN/PREN process.

Keywords

three-dimensional integrated circuits, 3D IC, die stacking, die alignment, fine-pitch interconnect, alignment keys, electrical coupling, die bonding, assembly process control.

FAQ

Q: What is this standard?

A: IEC 63011-2:2018 is the second part of a series on three-dimensional integrated circuits; it sets out alignment specifications and procedures for stacking dies that use fine-pitch electrical interconnects.

Q: What does it cover?

A: It covers initial alignment, alignment-maintenance procedures, alignment keys and tolerances for die-to-die alignment when electrical coupling alignment methods are used in die stacking—specifically for fine-pitch interconnects in 3D IC assemblies.

Q: Who typically uses it?

A: IC package designers, assembly and process engineers, equipment vendors (die bonders and alignment tools), test/quality engineers and procurement/specification authors who need to ensure reliable alignment for stacked-die assemblies.

Q: Is it current or superseded?

A: As published by IEC, IEC 63011-2:2018 is the current base publication (edition 1.0, published 28 November 2018) and the IEC listing shows a stability target indicating its text is expected to remain valid through 2029. National identical/adopted versions (for example BS IEC 63011-2:2018) have also been issued.

Q: Is it part of a series?

A: Yes. IEC 63011 is a multipart series addressing three-dimensional integrated circuits; Part 1 covers general conditions and definitions, Part 2 (this document) covers alignment, and Part 3 and others cover further subjects in the 3D IC domain.

Q: What are the key keywords?

A: Keywords include: three-dimensional integrated circuits, 3D IC, die stacking, die alignment, fine-pitch interconnect, alignment keys, electrical coupling, die bonding, and assembly process control.