IEC 63215-2-2023 PDF

Full title and description

Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices. This International Standard specifies a temperature-cycling evaluation method for die attach materials and joining systems used on discrete power electronic devices and defines a reliability classification (reliability performance index) for intercomparison of die attach solutions.

Abstract

IEC 63215-2:2023 defines the apparatus, specimen preparation, test profiles, inspection and measurement procedures (visual, thermal resistance, ultrasonic), end-of-test criteria and reporting items for temperature-cycling endurance tests of die attach materials applied to discrete power electronic devices. The method is intended for assessing die-attach joint materials and joining systems, not for certifying or guaranteeing full power-semiconductor device packages; results are intended for intercomparison when identical setups are used.

General information

• Status: Withdrawn (original publication active 24 October 2023; withdrawal recorded with IEC).
• Publication date: 24 October 2023 (ed. 1.0).
• Publisher: International Electrotechnical Commission (IEC), TC 91 Electronics assembly technology.
• ICS / categories: 31.190 — Electronic component assemblies.
• Edition / version: Edition 1.0 (2023).
• Number of pages: 46 (official IEC publication PDF).

Scope

The standard applies to die attach materials and the joining system used on discrete-type power electronic devices. It specifies a temperature-cycling test method that reflects actual use conditions for discrete power-electronic devices to evaluate die-attach joint reliability and to provide a reliability-performance classification. The method excludes direct evaluation of the semiconductor device itself and is not intended as a package-level reliability guarantee; results are primarily for comparative assessment when identical test setups are used.

Key topics and requirements

• Defined temperature-cycling profiles and chamber requirements (aligned with IEC 60068-2-14 test Na).
• Specimen preparation and die-bonding equipment requirements to reproduce representative discrete-device assemblies.
• Inspection and measurement methods: visual inspection, thermal-resistance measurement (annex A), and ultrasonic/scan acoustic methods for crack/void detection.
• End-of-test criteria, failure-cycle definition and intermediate/ final measurement procedures.
• Classification level (reliability performance index) and required items to be specified in product/test specifications for reproducibility and intercomparison.

Typical use and users

Used by die-attach material suppliers, electronics packaging and assembly engineers, reliability and qualification laboratories, semiconductor module designers, and QA/Test teams to compare die-attach materials and joining processes under accelerated thermal cycling representative of discrete power-device operating conditions. Test houses and OEMs use the procedures for material selection, process validation and supplier qualification. (Practical application and users summarized from the standard’s scope and test-objectives.)

Related standards

IEC 63215-2 references and aligns with environmental and measurement standards such as IEC 60068-2-14 (change of temperature, test Na) and IEC 60747-15 (thermal measurement methods) and belongs to the IEC 63215 series of endurance-test methods for die-attach materials (other parts addressing module-type interconnections and complementary test methods, e.g. Part 5 for module-type temperature cycling). The document was prepared by IEC TC 91 (Electronics assembly technology).

Keywords

die attach, die-attach materials, temperature cycling, thermal cycling, endurance testing, reliability performance index, discrete power electronic devices, thermal resistance, ultrasonic inspection, IEC 63215.

FAQ

Q: What is this standard?

A: IEC 63215-2:2023 is an IEC international standard that specifies a temperature-cycling test method for assessing the endurance of die attach materials and joining systems used on discrete power electronic devices.

Q: What does it cover?

A: It covers test apparatus requirements, specimen preparation, defined temperature-cycling profiles, inspection and measurement methods (visual, thermal-resistance and ultrasonic), end-of-test criteria, failure-cycle definition and reporting items, and assigns a reliability-performance classification for intercomparison of die-attach solutions. It explicitly excludes certifying the semiconductor device package itself.

Q: Who typically uses it?

A: Material suppliers, packaging and assembly engineers, reliability/test laboratories, OEM qualification teams and standards developers use it for material selection, process validation and comparative reliability assessment.

Q: Is it current or superseded?

A: The IEC record for this publication shows it was published in October 2023 (edition 1.0) and is listed with a withdrawal status in the IEC webstore record; users should confirm current national/adopted versions or later revisions before relying on it for mandatory processes.

Q: Is it part of a series?

A: Yes — IEC 63215 is a series of endurance-test-method standards for die-attach materials. Other parts (for example Part 5 addressing module-type temperature-cycling test methods) and normative references such as IEC 60068-2-14 are associated with the series.

Q: What are the key keywords?

A: Die attach, temperature cycling, thermal cycling, endurance testing, reliability index, discrete power electronic devices, thermal resistance, ultrasonic inspection.