IEC TR 62380-2004 PDF

Full title and description

IEC TR 62380:2004 — "Reliability data handbook — Universal model for reliability prediction of electronics components, PCBs and equipment". This technical report provides a handbook-style universal model and data elements to estimate failure rates of mounted electronic components, printed circuit boards and complete equipment, introducing influence factors and mission-profile considerations to support reliability prediction and optimisation activities.

Abstract

This technical report presents a universal, parametric model and supporting data for predicting the failure rates of electronic components, assemblies and equipment. It describes influence factors, mission-profile parameters, and recommended calculation approaches intended to produce consistent, comparable reliability predictions for components, PCBs and systems. The TR is presented as a handbook with tables, model equations and worked examples to assist engineers in reliability assessments.

General information

• Status: Withdrawn / Replaced (see related standards).
• Publication date: 17 August 2004.
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 21.020; 31.080.01.
• Edition / version: Edition 1.0 (2004).
• Number of pages: 90 (approx.).

Scope

Provides elements to calculate failure rates of mounted electronic components and guidance to apply influence factors and mission-profile data when predicting reliability of components, printed circuit boards and equipment. The report is intended to support equipment reliability optimisation studies by delivering a common model, data tables and worked examples for engineering use.

Key topics and requirements

• Universal parametric model for component and equipment reliability prediction (handbook format with tables and worked examples).
• Failure-rate components and sub-models for semiconductor devices, packages, discrete components, PCBs and assembled equipment.
• Introduction and use of influence factors (temperature, mechanical stress, mission profile, cycling, environment) to adapt baseline failure rates to conditions of use.
• Guidance on collecting and organising reliability data and applying mission-profile adjustments for consistent predictions.
• Examples and calculation methods intended to improve comparability of reliability assessments across projects and organizations.

Typical use and users

Practicing reliability engineers, design engineers, maintainability analysts and program managers in electronics, aerospace, defence, automotive and industrial sectors use the report as a reference for component-level and board-level reliability prediction. It is used during design reviews, parts selection, reliability allocation and early-life/stress analysis to quantify expected failure rates and to compare design options.

Related standards

IEC TR 62380:2004 has been superseded and its content incorporated into later editions of IEC 61709; the consolidated IEC 61709:2017 edition integrates material from TR 62380 and earlier IEC 61709 editions. Other related documents include sector and component-specific reliability standards and ISO/IEC reliability guidance used in functional-safety contexts.

Keywords

reliability prediction, failure rate, reliability data handbook, electronic components, printed circuit boards, mission profile, influence factors, IEC TR 62380, reliability model

FAQ

Q: What is this standard?

A: IEC TR 62380:2004 is a technical report (handbook) published by the IEC that provides a universal model and supporting data for predicting failure rates of electronic components, PCBs and equipment.

Q: What does it cover?

A: It covers parametric prediction methods, influence factors (temperature, environment, cycling, mission profile), data tables and worked examples to calculate and adapt baseline failure rates for components and assemblies.

Q: Who typically uses it?

A: Reliability engineers, design engineers, systems engineers and program managers in electronics-related industries (aerospace, defence, automotive, industrial electronics) use the TR for component selection, reliability allocation and comparative reliability studies.

Q: Is it current or superseded?

A: IEC TR 62380:2004 has been withdrawn as an active TR and its technical content was incorporated into later editions of IEC 61709 (notably consolidated in IEC 61709:2017). Users are generally advised to consult IEC 61709 (current edition) for the up-to-date normative guidance.

Q: Is it part of a series?

A: It is a single technical report (TR) that was later merged into the IEC 61709 family; it sits within IEC dependability/reliability publications rather than a multi‑part numbered series.

Q: What are the key keywords?

A: Failure rate, reliability prediction, mission profile, influence factors, electronic components, PCBs, reliability data handbook, IEC TR 62380.