IEC TR 62878-2-2-2015 PDF

Full title and description

IEC TR 62878-2-2:2015 — Device embedded substrate — Part 2-2: Guidelines — Electrical testing. This technical report provides guidance and example procedures for electrical testing of device-embedded substrates, including interconnection open- and short-circuit tests and device functional tests; it is published bilingually in English and French.

Abstract

This Technical Report describes necessary information and recommended practices for electrical verification of substrates that have devices embedded into the substrate structure. It details test levels and demonstrated procedures (open/short interconnection tests, functional tests and related procedures) to help manufacturers and test laboratories assess electrical integrity of device embedded substrates.

General information

• Status: Technical Report (published / active as of original publication).
• Publication date: 4 December 2015 (Edition 1.0).
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.180; 31.190 (Printed circuits and boards; Electronic component assemblies).
• Edition / version: Edition 1.0 (2015).
• Number of pages: 29 pages (bilingual EN/FR).

Scope

This part of IEC 62878 provides guidelines for electrical tests applied to device-embedded substrates fabricated using organic base materials. It covers interconnection open- and short-circuit testing and device functional testing, and presents test-level classifications and example procedures for demonstration of electrical integrity. The guidance is intended for embedded active and passive devices formed during substrate fabrication; the IEC 62878 family excludes the re-distribution layer (RDL) and modules defined under the M-type business model in IEC 62421.

Key topics and requirements

• Definition of electrical test levels for device-embedded substrates (test levels 1A, 1B, 2A, 2B and 3) and illustrative figures.
• Interconnection open-circuit and short-circuit test methods and pass/fail criteria for embedded interconnects.
• Device functional test procedures to verify embedded device operation after embedding and processing.
• Recommended test setups, circuit models, simulation examples and demonstration guidance to help reproduce and interpret electrical test results.
• Guidance scoped to substrates using organic base materials; limitations and exclusions (e.g., RDL and specific electronic module types).
• Reference to TC 91 (Electronics assembly technology) as the responsible technical committee.

Typical use and users

Primary users are PCB/substrate designers, embedded-device process engineers, manufacturing test engineers, qualification and reliability laboratories, and standards committees. The report is used when establishing electrical acceptance tests for new embedded-substrate processes, for supplier qualification, and as implementation guidance for manufacturers adopting device-embedding technologies.

Related standards

This TR is part of the IEC 62878 family and is intended to be read with other parts of that series, including IEC 62878-1-1 (Generic specification — Test methods) and IEC 62878-2-1 (Guidelines — General description of technology). It also complements established test-method standards such as IEC 61189-3 (test methods for interconnection structures / printed boards). Later consolidated editions of IEC 62878 (e.g., IEC 62878-1:2019) reference this TR.

Keywords

device embedded substrate; electrical testing; interconnection test; open-circuit test; short-circuit test; functional test; TC 91; printed circuit board; embedded component; IEC 62878.

FAQ

Q: What is this standard?

A: IEC TR 62878-2-2:2015 is a Technical Report that provides guidelines for electrical testing of substrates with embedded devices (device-embedded substrates). It supplements the IEC 62878 series by giving example test levels and demonstration procedures.

Q: What does it cover?

A: It covers electrical verification methods including interconnection open/short-circuit tests, device functional tests, test-level definitions and recommended test procedures for device-embedded substrates manufactured using organic base materials.

Q: Who typically uses it?

A: PCB and substrate manufacturers, process and test engineers, reliability and qualification laboratories, procurement/spec teams for supplier assessment, and standards developers working on embedded-substrate technologies.

Q: Is it current or superseded?

A: The document was published on 4 December 2015 as Edition 1.0. It is a Technical Report (not a binding International Standard) and remains a referenced guidance document within the IEC 62878 series; IEC webstore records a stability planning date associated with the series (references in the series indicate stability into the early 2030s). Users should check national/adopted versions or the IEC webstore for the latest status before relying on it for compliance.

Q: Is it part of a series?

A: Yes — it is Part 2-2 of the IEC 62878 family (Device embedded substrate). Other relevant parts include IEC 62878-1-1 (generic test methods), IEC 62878-2-1 (technology description), and additional Parts/TS/TRs and subsequent consolidated editions of IEC 62878.

Q: What are the key keywords?

A: Device embedded substrate; electrical testing; interconnection; open-circuit; short-circuit; functional test; embedded components; printed circuit board; IEC 62878; TC 91.