ISO 4746-1977 PDF

Full title and description

ISO 4746:1977 — Oxygen-free copper — Scale adhesion test. A short, single-test International Standard that specifies a procedure for assessing the adhesion of oxide (scale) formed on oxygen‑free copper when used in applications such as electronic devices and glass‑to‑metal seals.

Abstract

Provides a means of assessing the usability of oxygen‑free copper in applications that rely on an adherent copper‑oxide film. The method calls for preparation of a test specimen, heating in air to form the oxide film, rapid cooling (quenching) in water and a visual examination to detect loss of oxide, blistering or detachment. The standard is deliberately concise (one page) and intended for quality control and acceptance testing.

General information

• Status: Published / International Standard (confirmed through periodic ISO review).
• Publication date: 1 August 1977 (Edition 1, 1977).
• Publisher: International Organization for Standardization (ISO).
• ICS / categories: 77.040.99 — Other methods of testing of metals; developed by ISO/TC 26 (Copper and copper alloys).
• Edition / version: Edition 1 (1977).
• Number of pages: 1 (concise single‑page test method).

General product metadata (status, edition and page count) are recorded on the ISO catalogue and national distributor product pages.

Scope

Specifies a short, reproducible test to evaluate the adhesion of oxide scale on oxygen‑free copper used where an adherent oxide film is functionally important (for example in glass‑to‑metal seals and some electronic components). The procedure covers specimen preparation, controlled heating in air to form the oxide layer, immediate quenching in water and visual inspection for film loss, blistering or uneven adherence. The standard is intended for use in production‑control and materials assessment.

Key topics and requirements

• Purpose: determine whether oxide (scale) formed on oxygen‑free copper is adherent and acceptable for the intended application (electronics, seals).
• Specimen preparation: defined small test pieces (wire or strips), surface cleaning and degreasing to ensure consistent oxide formation.
• Oxide formation: controlled heating in air to produce the oxide film (procedure specifies temperature/time to form a representative film).
• Thermal shock: rapid cooling/quenching in water to test adhesion under stress induced by thermal cycling.
• Evaluation: visual examination to detect loss of oxide film, blistering or detachment; acceptance criteria are primarily based on absence of film loss or blistering across the test surface.

These topics summarise the standard’s essential requirements for conducting and assessing the scale‑adhesion test.

Typical use and users

Used by metallurgical and quality laboratories, manufacturers and suppliers of oxygen‑free copper and copper alloys, engineers responsible for glass‑to‑metal seals, and R&D groups evaluating material behaviour under thermal stress. The test is commonly applied during incoming material inspection, production quality checks and failure‑analysis investigations.

Related standards

Related documents include other ISO and national standards on test methods for copper and copper alloys and on material testing produced under ISO/TC 26. ISO 4746 has also been issued in national/adopted forms (for example as a corresponding British Standard reference). Users should consult the ISO catalogue or their national standards body for cross‑references and any national equivalents or amendments.

Keywords

oxygen‑free copper; scale adhesion; copper oxide; oxide film; adhesion test; thermal shock; quench test; glass‑to‑metal seal; ISO/TC 26; metal testing (ICS 77.040.99).

FAQ

Q: What is this standard?

A: ISO 4746:1977 is an International Standard titled "Oxygen‑free copper — Scale adhesion test" that defines a concise, single‑page method to assess the adhesion of oxide scale on oxygen‑free copper.

Q: What does it cover?

A: It covers specimen preparation, heating in air to form an oxide film, rapid cooling (quenching) in water and visual inspection for loss of film or blistering — i.e., a practical adhesion test for oxide scale on oxygen‑free copper.

Q: Who typically uses it?

A: Metallurgical test laboratories, copper manufacturers and suppliers, electronic component manufacturers (where oxide adherence matters), and quality/inspection teams performing acceptance or failure‑analysis tests.

Q: Is it current or superseded?

A: The original publication date is 1 August 1977 (Edition 1). ISO’s catalogue shows the standard as published and subject to periodic review; consult ISO or your national standards body for the latest confirmation or any national adoption. As of the ISO catalogue records, the 1977 edition remains the recorded edition.

Q: Is it part of a series?

A: It is a stand‑alone test method developed under ISO/TC 26 (Copper and copper alloys). It is related to other ISO test methods and national standards for copper testing but is not a numbered multi‑part series by itself.

Q: What are the key keywords?

A: oxygen‑free copper; scale adhesion; oxide film; quench; thermal shock; visual inspection; copper testing; ICS 77.040.99.