ISO 8181-2023 PDF
Name in English:
St ISO 8181-2023
Name in Russian:
Ст ISO 8181-2023
Original standard ISO 8181-2023 in PDF full version. Additional info + preview on request
Full title and description
ISO 8181:2023 — Atomic layer deposition — Vocabulary. This International Standard provides a harmonized set of terms and definitions covering atomic layer deposition (ALD) techniques, film growth processes and related terminology used in research, industry and education for ALD technology.
Abstract
This document defines general terms and film growth processes for atomic layer deposition (ALD). It classifies ALD techniques (for example, conventional time‑separated ALD and spatial ALD), includes processes for coating planar substrates and micro/nano particles (powder ALD), and covers certain energy‑enhanced ALD methods. The standard applies to ALD process descriptions and terminology; it does not specify deposited materials or particular nanostructures and is intended for industrial production, scientific research, teaching and technical communication.
General information
- Status: Published (International Standard)
- Publication date: October 2023
- Publisher: International Organization for Standardization (ISO)
- ICS / categories: 01.040.25 (Manufacturing engineering — Vocabularies); 25.220.01 (Surface treatment and coating in general)
- Edition / version: Edition 1 (2023)
- Number of pages: 10
Key bibliographic and status details above are taken from the ISO bibliographic record for ISO 8181:2023.
Scope
ISO 8181:2023 standardizes the vocabulary used to describe ALD processes and film growth phenomena. It covers classifications of ALD process types (time‑separated and spatial ALD), powder ALD for particulate substrates, and energy‑enhanced variants, and is intended to be applicable across industrial production, academic research, teaching and technical publication contexts. The scope explicitly excludes prescriptive requirements for specific deposited materials or nanostructure designs.
Key topics and requirements
- Standardized definitions for fundamental ALD terms (e.g., precursor, pulse, purge, monolayer, saturation).
- Classification of ALD process types: conventional time‑separated ALD and spatial ALD.
- Vocabulary covering powder ALD (coating of micro‑ and nano‑particles) and coating geometries beyond planar substrates.
- Inclusion of energy‑enhanced ALD techniques and terminology for process variants.
- Definitions related to film growth processes and measurement/characterization terms commonly used in ALD literature and industry applications (microelectronics, photovoltaics, displays, energy and catalysis contexts).
Concepts above reflect the terminology and topical coverage specified by the standard and related publisher summaries.
Typical use and users
Primary users include researchers and engineers working in thin‑film deposition and surface coating, equipment manufacturers, process engineers in microelectronics and photovoltaics, academic teachers and authors preparing technical publications, and standards developers. The vocabulary supports clearer communication across R&D, production, quality, and regulatory documentation where ALD terminology must be consistent.
Related standards
ISO 8181:2023 is produced under ISO/TC 107 (Surface chemical analysis / surface treatment and coatings) and is associated with other work items on ALD, including related technical reports and draft standards on ALD precursors and process specifications. National adoptions and national versions (for example BS ISO 8181) are available from national standards bodies.
Keywords
Atomic layer deposition; ALD; vocabulary; terminology; film growth; spatial ALD; time‑separated ALD; powder ALD; precursors; thin films; surface coating.
FAQ
Q: What is this standard?
A: ISO 8181:2023 is an international vocabulary standard that defines terms and expressions used in atomic layer deposition (ALD) technology to ensure consistent terminology across research, industry and education.
Q: What does it cover?
A: It covers general ALD terms, classifications of ALD process types (time‑separated and spatial), powder ALD for particulate substrates, certain energy‑enhanced ALD variants, and film growth process terminology. It does not specify materials or detailed process specifications for particular deposited nanostructures.
Q: Who typically uses it?
A: Researchers, process and equipment engineers, manufacturers in microelectronics and photovoltaics, academic instructors, technical authors and standards developers who require consistent ALD terminology.
Q: Is it current or superseded?
A: ISO 8181:2023 is a current, published International Standard (Edition 1, 2023). Users should check national standards bodies for any national adoptions or implementation dates.
Q: Is it part of a series?
A: ISO 8181:2023 is a standalone vocabulary document for ALD but relates to other ISO/TC 107 work items and ALD‑related technical reports and specifications; complementary documents and future process/specification standards for ALD precursors and processes are under development.
Q: What are the key keywords?
A: Atomic layer deposition (ALD); spatial ALD; time‑separated ALD; powder ALD; precursor; monolayer; film growth; thin film; vocabulary; terminology.