BS EN 62047-3-2006 PDF

Full title and description

BS EN 62047-3:2006 — Semiconductor devices — Micro‑electromechanical devices — Part 3: Thin film standard test piece for tensile testing. This document specifies a standard tensile test specimen (test piece) intended to validate the propriety and accuracy of tensile testing systems used for thin‑film structural materials in MEMS and micromachines.

Abstract

This standard defines the geometry, fabrication characteristics and acceptance criteria for a thin‑film standard test piece used to verify tensile test equipment and procedures for films with very small dimensions (typical gauge dimensions under 1 mm laterally and thicknesses below the micron/10 µm range). It is intended to reduce inter‑specimen scatter, enable reproducible tensile‑strength measurements, and support statistical validation of tensile test systems for MEMS materials.

General information

• Status: Adopted/active as IEC/EN/BS national adoption (identical to EN 62047-3:2006 and IEC 62047-3:2006).
• Publication date: 2006 (IEC publication: 15 August 2006; BS/EN national publication/adoption: 30 November 2006).
• Publisher: International Electrotechnical Commission (IEC) — published as IEC 62047-3:2006; adopted as EN 62047-3:2006 and published by national bodies (e.g., BSI as BS EN 62047-3:2006).
• ICS / categories: 31.080.99 (Other semiconductor devices / MEMS related).
• Edition / version: Edition 1.0 (first edition, 2006).
• Number of pages: National/publication variations reported (IEC webstore lists 15 pages; some national publications list 12 pages).

Scope

The standard applies to thin‑film materials used as structural elements in micro‑electromechanical devices and micromachines and specifies a standardised test piece geometry and related requirements for tensile testing. It is focused on specimens whose lateral dimensions are typically below 1 mm and whose thicknesses are in the thin‑film range (micrometres and below), and is intended to allow verification/calibration of tensile test systems and to minimise specimen‑to‑specimen variability.

Key topics and requirements

• Specified specimen geometry (gauge section, transition radii and overall layout) tailored to microfabricated thin films to reduce stress concentrations and handling damage.
• Dimensional limits and design guidance for specimens (typical length/width under 1 mm; thickness in the thin‑film range).
• Material and fabrication considerations: recommendations to limit variation (e.g., controlled deposition, microfabrication and photolithography techniques).
• Measurement and instrumentation guidance (non‑contact thickness measurement where appropriate; gauge marking practices for elongation measurement).
• Test validation concept: use of test pieces with predetermined tensile properties to verify tensile testing system propriety and accuracy and to enable statistical evaluation (multiple specimens from same lot).
• Documentation and traceability requirements for standard test pieces supplied for equipment validation.

Typical use and users

Primary users include MEMS and micromachining device manufacturers, materials characterization laboratories, research and development groups working on thin‑film materials, and test‑equipment suppliers/calibration laboratories that need to verify tensile testing systems for micro‑scale films. The standard is used for equipment validation, method development and quality control of thin‑film mechanical testing.

Related standards

IEC 62047 is a multipart series addressing MEMS mechanical testing and terminology; related parts include IEC 62047-1 (Terms and definitions) and IEC 62047-2 (Tensile testing methods of thin film materials). Other parts in the 62047 series and downstream/mechanical test standards (e.g., parts addressing electromechanical test methods) are relevant when developing a full test program for MEMS components.

Keywords

MEMS, micro‑electromechanical devices, thin film, tensile testing, test piece, specimen geometry, standard test piece, microfabrication, tensile strength, gauge section, equipment validation.

FAQ

Q: What is this standard?

A: It is the IEC/EN/BS standard (IEC 62047-3:2006, adopted as EN 62047-3:2006 and BS EN 62047-3:2006) that specifies a standard thin‑film tensile test piece used to verify and validate tensile testing systems for MEMS thin films.

Q: What does it cover?

A: The standard covers the design and required characteristics of a thin‑film standard tensile specimen (geometry, fabrication guidance, measurement and documentation) and the concept of using specimens with predetermined properties to check accuracy and reproducibility of tensile test systems for films with dimensions typical of MEMS.

Q: Who typically uses it?

A: MEMS manufacturers, academic and industrial research labs, materials testing/characterization labs, calibration/equipment suppliers, and quality/control engineers responsible for mechanical testing of thin films.

Q: Is it current or superseded?

A: As published in 2006 it remains the first edition (IEC 62047-3:2006) and was adopted as EN/BS EN 62047-3:2006. The IEC webstore lists the publication and a stability/maintenance date; users should check the IEC or their national standards body for any later amendments or revisions before use. (IEC publication record and national adoption details cited).

Q: Is it part of a series?

A: Yes — IEC/EN 62047 is a multipart series on semiconductor micro‑electromechanical devices (MEMS). Part 1 covers terms and definitions; Part 2 addresses tensile testing methods for thin films; Part 3 defines the standard test piece. Other parts in the series cover additional test methods and specifications.

Q: What are the key keywords?

A: MEMS, thin film, tensile test specimen, tensile testing, standard test piece, specimen geometry, microfabrication, gauge length, tensile strength.