BS EN 62047-4-2010 PDF

Full title and description

STB BS EN 62047-4:2010 — Semiconductor devices — Micro‑electromechanical devices — Part 4: Generic specification for MEMS. This publication is the European/BS adoption of the IEC generic specification that provides a framework for describing, testing and assessing the quality of MEMS devices manufactured using semiconductor technology.

Abstract

This part of IEC/EN 62047 specifies generic requirements and procedures for micro‑electromechanical systems (MEMS) made principally from semiconductor materials. It establishes principles for quality assessment (for use within IECQ/CECC systems), and general guidance for describing and testing electrical, mechanical, environmental and other characteristics of MEMS while excluding certain application families (for example optical MEMS, bio‑MEMS, micro‑TAS and power MEMS in the 2010 adoption).

General information

• Status: Published / national adoption active in many countries (BS EN adoption 2010). Note: an IEC 2025 revision (edition 2) has been progressed, see maintenance notes below.
• Publication date: EN/BS adoption 2010 (BS listing 30 November 2010; EN formal adoption October–December 2010); based on original IEC 62047‑4:2008.
• Publisher: BSI as BS EN (national adoption); original text: IEC (published as IEC 62047‑4:2008) and adopted by CENELEC/national bodies.
• ICS / categories: 31.080.x / 31.220.x — semiconductor / electromechanical device classification (often listed under 31.080.99 or 31.220.01 in catalogues).
• Edition / version: Edition corresponding to EN 62047‑4:2010 (based on IEC 62047‑4:2008). National publication page counts and minor presentation details vary by publisher.
• Number of pages: Typically reported as 22–24 pages depending on national print/PDF format.

Scope

This part gives generic specifications for MEMS manufactured on the basis of semiconductor technology and provides a basis for device‑ or application‑specific parts of the 62047 series (for example sensors and RF MEMS). The 2010/2008 text explicitly excludes optical MEMS, bio‑MEMS, micro‑TAS and power MEMS from its scope (these exclusions are addressed in later or separate parts of the series). The standard covers general procedures for quality assessment, device description, handling, test and measurement principles, and references established environmental and mechanical test families (e.g. IEC 60068, IEC 60749).

Key topics and requirements

• Generic device description and terminology to support MEMS specification and test reporting.
• Quality assessment procedures suitable for IECQ/CECC systems (qualification, capability approval, lot formation, subcontracting considerations).
• Test and measurement principles for electrical, mechanical and environmental characteristics (references to standard environmental/mechanical test suites).
• Sampling and acceptance criteria (including normative sampling procedures and informative classification guidance for MEMS technologies and devices).
• Guidance on marking, handling, assembly, process control and measurement methods relevant to MEMS manufacture and evaluation.

These topics are intended to serve as a generic foundation to be adapted by subsequent, device‑specific parts of the IEC 62047 family.

Typical use and users

Used by MEMS manufacturers, test laboratories, quality managers, procurement/specification engineers and national standards committees. It is particularly useful for organisations participating in IECQ/CECC quality assessment and for developers preparing device‑specific standards within the 62047 series.

Related standards

The document is part of the IEC 62047 series (Micro‑electromechanical devices — MEMS). Related parts include terms and definitions (Part 1), thin‑film tensile test methods (Parts 2 and 3), and numerous test method parts (for example Parts 6–12, 29, 30, etc.) that specify mechanical, thermal and material test methods for MEMS. Newer editions or additional parts in the series may have been published after the 2010 adoption.

Keywords

MEMS, micro‑electromechanical systems, semiconductor devices, generic specification, quality assessment, IECQ, CECC, testing, environmental tests, device classification

FAQ

Q: What is this standard?

A: STB BS EN 62047‑4:2010 is the British/European adoption of the IEC generic specification for MEMS — Part 4 of the IEC 62047 series — providing generic requirements and procedures for MEMS made using semiconductor technology.

Q: What does it cover?

A: It covers generic descriptions, quality assessment procedures, and general principles for testing and measuring electrical, mechanical and environmental characteristics of MEMS (excluding certain specialised MEMS families in the 2010 text). It also provides guidance for sampling, marking and process control as a basis for device‑specific standards.

Q: Who typically uses it?

A: MEMS manufacturers, qualification and test laboratories, quality/production engineers, procurement/specification teams and standards developers who need a generic framework for describing and qualifying MEMS. It is also used within IECQ/CECC schemes.

Q: Is it current or superseded?

A: BS EN 62047‑4:2010 is the 2010 national adoption of the IEC 62047‑4:2008 text. As of late 2025 the IEC has progressed a second edition (IEC 62047‑4:2025) in the maintenance cycle; users should check national catalogue entries to determine whether a national adoption of the 2025 edition or any amending corrigenda exists for their country. National adoptions and the practical status at the national level can vary.

Q: Is it part of a series?

A: Yes — it is Part 4 of the IEC 62047 series (Semiconductor devices — Micro‑electromechanical devices). The series contains multiple parts addressing terminology, test methods, material characterisation and various device‑specific test procedures.

Q: What are the key keywords?

A: MEMS, micro‑electromechanical devices, semiconductor, quality assessment, IECQ, CECC, testing, environmental tests, sampling, device classification