BS IEC 62047-35-2019 PDF

Full title and description

Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices. This international standard specifies a laboratory test method to evaluate how the electrical characteristics of flexible electromechanical (MEMS) devices change when the device is bent or folded, enabling assessment of degradation behaviour and safety margins for flexible and foldable electronic products.

Abstract

IEC 62047-35:2019 defines a quasi-static folding/bending test in which a flexible device is gradually bent (monotonically) up to maximum curvature (including full folding) while electrical performance is monitored. The method applies to passive and active micro-components on or embedded in flexible films (typical in-plane device sizes ~1 mm to 300 mm, thicknesses ~10 µm to 1 mm) and is intended to provide repeatable procedures for apparatus, measurement, reporting and interpretation of degradation under bending.

General information

• Status: Published.
• Publication date: 22 November 2019 (Edition 1.0, 2019-11).
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 31.080.99 (Other semiconductor devices).
• Edition / version: Edition 1.0 (2019).
• Number of pages: 41 pages (official IEC publication).

Scope

Specifies a test method for measuring electrical characteristics of flexible electromechanical devices under bending deformation. The procedure concentrates on monotonic, quasi-static bending (folding) to the maximum possible curvature so that the entire degradation behaviour of electrical properties is observed. The standard covers devices with in‑plane dimensions typically from 1 mm to 300 mm and thicknesses typically from 10 µm to 1 mm, and describes requirements for test pieces, apparatus, measurement, test conditions and reporting. It is intended to support safety-margin estimation and reliable design for flexible/foldable device applications.

Key topics and requirements

• Test principle: monotonic, quasi-static folding/bending until maximum curvature (including full fold) while continuously or stepwise monitoring electrical performance.
• Device applicability: passive and active micro-components on or embedded in flexible films (typical size/thickness ranges given).
• Test piece and fixture requirements: recommended shapes, wall dimensions, surface flatness/roughness and gap control so folding progresses without premature contact.
• Measurement requirements: accuracy and methods for recording folding distance, measurement timing, and handling of time-dependent effects (user to report test speed/holding times).
• Reporting: specified test conditions, bending directions and axes, test piece geometry, degradation behaviour and any observed time-dependent phenomena.
• Normative/informative annexes: examples, apparatus guidance and commentary on local loading and measurement techniques.

Typical use and users

Used by MEMS and flexible-electronics designers, reliability engineers, test laboratories, component manufacturers and qualification teams who need to quantify electrical performance degradation under bending/folding (e.g., wearable sensors, foldable displays, flexible interconnects). It is intended for product development, qualification and comparative evaluation of flexible electromechanical components.

Related standards

Part of the IEC 62047 series (TC 47/SC 47F) covering MEMS and micro-electromechanical test methods. Other parts in the series address topics such as piezoresistive pressure-device test methods (IEC 62047-34:2019), environmental and dielectric withstand tests for MEMS piezoelectric thin films (IEC 62047-36:2019), and additional MEMS test methods and measurement procedures in related parts. Users commonly consult adjacent parts of IEC 62047 when creating a comprehensive test plan.

Keywords

IEC 62047-35, flexible MEMS, bending test, folding test, electrical characteristics, micro-electromechanical devices, MEMS test method, semiconductor devices, TC 47/SC 47F, reliability testing.

FAQ

Q: What is this standard?

A: IEC 62047-35:2019 is an international standard that defines a test method to evaluate electrical characteristics of flexible electromechanical (MEMS) devices under bending and folding deformation.

Q: What does it cover?

A: It covers procedures for preparing test pieces, apparatus recommendations, stepwise or continuous folding to maximum curvature, measurement of electrical parameters during bending, accuracy requirements for folding-distance measurement, and reporting items needed to characterise degradation under bending. Typical device sizes and thickness ranges are given as guidance.

Q: Who typically uses it?

A: MEMS manufacturers, reliability/test laboratories, R&D teams for flexible electronics, component and module suppliers, and QA/qualification engineers who evaluate product robustness to bending and folding.

Q: Is it current or superseded?

A: As published by IEC, IEC 62047-35:2019 is an active published International Standard (Edition 1.0, 2019). The IEC webstore lists a stability date and the publication lifecycle; users should check the IEC catalogue or national bodies for any amendments or replacement notices.

Q: Is it part of a series?

A: Yes — it is part of the IEC 62047 series for semiconductor/MEMS test methods developed by TC 47/SC 47F. Other parts in the series cover complementary MEMS test methods (for example IEC 62047-34, IEC 62047-36, etc.).

Q: What are the key keywords?

A: Flexible MEMS, bending deformation, folding test, electrical degradation, MEMS test method, semiconductor devices, reliability testing, TC 47/SC 47F, IEC 62047-35.