DIN EN 61190-1-2 2014-11 PDF

Full title and description

STB DIN EN 61190-1-2 2014-11 — National adoption of DIN EN 61190-1-2 (2014) concerning soldering materials for electronic assemblies. This document defines the scope, classification, fundamental requirements and general test principles for soldering materials used in electronic assembly processes, and provides normative references and guidance for marking and conformity assessment as adopted nationally under the STB designation.

Abstract

This standard is the STB national publication of the DIN EN 61190-1-2 text dated November 2014. It belongs to the IEC/EN 61190 series addressing materials and processes for soldering in electronic assemblies. The standard establishes terminology, classification schemes, essential properties, and basic test methods and acceptance criteria relevant to soldering materials (for example fluxes and related auxiliaries) used in industrial electronics production. It is intended to harmonize requirements across manufacturers, testing laboratories and procurement organizations to ensure reliable soldering performance and interchangeability of materials.

General information

• Status: Published (national adoption of DIN EN 61190-1-2).
• Publication date: November 2014 (2014-11).
• Publisher: STB (national adoption of the DIN EN 61190-1-2 text; originally prepared under DIN/EN/CENELEC frameworks).
• ICS / categories: Electronics; soldering materials and processes (approximate ICS grouping within electronics manufacturing standards).
• Edition / version: 1st national edition (based on the 2014 DIN EN text).
• Number of pages: Approx. 12–20 pages (national adoption documents of this type are typically concise; exact page count may vary by publisher formatting).

Scope

STB DIN EN 61190-1-2 sets out the scope and general requirements for soldering materials used in electronic assembly processes. The standard covers classification and definitions, essential physical and chemical properties relevant to soldering performance, basic test principles, marking and documentation requirements, and general guidance for conformity and selection of appropriate materials for specific soldering processes (for example reflow and wave soldering). It is not a process specification for a particular assembly line but a materials-focused standard intended to be referenced by manufacturers, test laboratories and procurement specifications.

Key topics and requirements

• Definitions and terminology for soldering materials and related auxiliaries.
• Classification schemes for soldering materials (by type, activity, residue behavior and intended process).
• Essential requirements for chemical composition and physical properties affecting solderability and reliability.
• General test principles and recommended test methods for evaluating performance (wetting, activation, residue, corrosion potential, residue removability where applicable).
• Marking, labelling and documentation requirements to ensure traceability and correct use in production.
• Guidance on conformity assessment and on harmonizing material declarations with regulatory frameworks (e.g., restrictions on hazardous substances).

Typical use and users

Typical users of this standard include soldering material manufacturers, electronic assembly houses, quality and R&D engineers, procurement specialists, testing and certification laboratories, and standards/specification writers. The standard is used when specifying materials in purchase documents, designing qualification tests, creating internal material approvals, or aligning supplier declarations with industry practice.

Related standards

STB DIN EN 61190-1-2 is part of the broader IEC/EN 61190 series on materials for soldering and is commonly used alongside related standards and industry documents such as other EN/IEC 61190 parts addressing additional material types and test methods, IPC J-STD series (for soldering processes and flux classification), and regional product safety or chemical restriction regulations. Users typically reference the specific part numbers applicable to their material type and process when developing procurement or test specifications.

Keywords

soldering materials; flux; electronic assemblies; classification; test methods; marking; material requirements; solderability; reflow; wave soldering; conformity.

FAQ

Q: What is this standard?

A: This is the STB national adoption of DIN EN 61190-1-2 (published November 2014). It is a materials-focused standard in the IEC/EN 61190 family that addresses classification and general requirements for soldering materials used in electronic assembly.

Q: What does it cover?

A: It covers terminology, classification, essential material properties, general test principles and guidance for marking and documentation—helping manufacturers, users and test labs to specify and assess soldering materials consistently. It is not a line-specific process specification.

Q: Who typically uses it?

A: Manufacturers of soldering materials and electronic assemblies, quality and R&D engineers, procurement teams, testing laboratories and conformity assessors use this standard when specifying, approving or testing soldering-related materials.

Q: Is it current or superseded?

A: The document title indicates publication in November 2014. To confirm whether it remains current or has been amended or superseded, check with the national standards body (STB) or the national catalogue; national adoptions of EN/IEC texts are occasionally updated or withdrawn. This product page reflects the 2014 adoption details.

Q: Is it part of a series?

A: Yes. It is part of the IEC/EN 61190 series, which contains multiple parts covering different soldering material types and more detailed test methods; users commonly reference the particular part(s) relevant to their material and process.

Q: What are the key keywords?

A: soldering materials, flux, electronics assembly, classification, test methods, solderability, reflow, wave soldering, marking, conformity.