PD ES 59008-5-2-2001 PDF

Full title and description

PD ES 59008-5-2:2001 — Data requirements for semiconductor die — Part 5-2: Particular requirements and recommendations for die types — Bare die with added connection structures. This European specification / BSI published PD gives data-exchange requirements and practical recommendations for handling, testing and supplying bare semiconductor die that have added connection structures (bumps, TAB, plated features, etc.).

Abstract

This specification defines the information and data requirements needed when transferring design, test, handling and process information for bare semiconductor die with added connection structures. It includes guidance on traceability, probing, handling and packing, thermal and electrical considerations, recommended materials (bumps, solders, adhesives), and outlines the minimum data set to allow assemblers, test houses and purchasers to evaluate and use such die reliably.

General information

• Status: Current / Active (published as a PD/ES document and listed as available).
• Publication date: 2001 (document reference PD ES 59008-5-2:2001; CENELEC approval and national announcement dates in 2000–2001).
• Publisher: British Standards Institution (BSI) publishing the PD; originally issued as a European Specification (ES 59008-5-2) under CENELEC.
• ICS / categories: 31.080.01 — Semiconductor devices in general (electronic components / semiconductors).
• Edition / version: PD ES 59008-5-2:2001 (first published PD/ES edition, 2001).
• Number of pages: 12 pages (typical published PDF length for the PD).

Scope

This part of the ES 59008 series specifies the minimum data and information that suppliers of bare semiconductor die with added connection structures must provide to enable downstream processes (probing, assembly, testing and application) to be performed reliably. It covers specific recommendations for test & quality data, user/assembler information (bump and solder types, adhesives, underfill, encapsulants), handling and storage, thermal and electrical considerations (including redistribution and backside connections), and application-environment notes (photo-sensitivity, extended temperatures, MEMS considerations). The document is intended for data exchange and practical good-practice guidance rather than mandating manufacturing methods.

Key topics and requirements

• Data and document set required for bare die with connection structures (identification, dimensional data, pad/bump geometry, material specifications).
• Traceability and marking requirements for die identity and lot information.
• Probing and test recommendations for bumped/TAB die, including protection of connection structures.
• Handling, pick-and-place and storage recommendations (backside fiducials, orientation, packing precautions).
• Materials guidance — bump materials, solder types, fluxing, adhesives and underfill recommendations.
• Thermal management guidance (backside heat-sinking, peak process temperatures, TCE considerations).
• Electrical considerations — redistribution, simulation data and backside connection recommendations.
• Application-environment notes (optical/photo sensitivity, MEMS-specific protection, extended temperature use).

Typical use and users

Primary users include semiconductor wafer/die suppliers, known-good-die programs, OSATs and subcontract assembly houses, test and probe laboratories, component data managers, OEM design and reliability engineers, and procurement teams who need a standardized data set to accept and apply bare die with added connection structures. The specification is used when exchanging die specification and process limitations to avoid assembly failures and to support reliable integration.

Related standards

ES 59008-5-2 is part of the ES 59008 series (Parts 1–6) that address data requirements for semiconductor die; many parts of the ES 59008 family have subsequently been incorporated into or superseded by the EN/IEC 62258 series (data dictionaries and component data element standards). Other related documents include adjacent ES 59008 parts covering vocabulary, mechanical/material/connectivity requirements, thermal and electrical recommendations, and known-good-die handling. For full program and replacement history see the EN/IEC 62258 series and national adoption notices.

Keywords

semiconductor die, bare die, bumped die, data requirements, PD ES 59008-5-2, connection structures, traceability, handling, probing, thermal management, electrical simulation, known-good die, BSI, CENELEC

FAQ

Q: What is this standard?

A: PD ES 59008-5-2:2001 is a European Specification / BSI-published PD that specifies data and information requirements and recommendations for bare semiconductor die that have added connection structures (e.g., bumps, TAB).

Q: What does it cover?

A: It covers the minimum data set and practical recommendations needed for reliable probing, handling, testing, storage and assembly of bare die with connection structures — including materials, thermal and electrical considerations, marking and traceability.

Q: Who typically uses it?

A: Die suppliers, known-good-die programs, OSATs (outsourced semiconductor assembly and test providers), test labs, design and reliability engineers, and procurement teams exchanging die data and assembly/process limits.

Q: Is it current or superseded?

A: The PD/ES was published in 2001 and is listed as an active PD document; however, many parts of the ES 59008 series have subsequently been incorporated into or replaced by the EN/IEC 62258 series. Users should check the current status with their national standards body or BSI/CENELEC for the latest adoption or replacement details.

Q: Is it part of a series?

A: Yes — it is one part of the ES 59008 series (Data requirements for semiconductor die), which includes parts on general requirements, vocabulary, mechanical/material/connectivity requirements, thermal and electrical recommendations, and a data dictionary.

Q: What are the key keywords?

A: Bare die, bumped die, connection structures, data exchange, traceability, handling, probing, thermal management, solder, bump material, known-good die.