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Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA. Original standard BS EN 60191-6-16-2007 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array. Original standard BS EN 60191-6-17-2011 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA). Original standard BS EN 60191-6-18-2010 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage. Original standard BS EN 60191-6-19-2010 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages. Original standard BS EN 60191-6-2-2002 (2003) in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ). Original standard BS EN 60191-6-20-2010 in PDF full version. Additional info + preview on request
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