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Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Shear strength test. Original standard BS EN 62137-1-2-2007 in PDF full version. Additional info + preview on request
Document status: Active
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic drop test. Original standard BS EN 62137-1-3-2009 in PDF full version. Additional info + preview on request
Document status: Active
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic bending test. Original standard BS EN 62137-1-4-2009 in PDF full version. Additional info + preview on request
Document status: Active
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints - Mechanical shear fatigue test. Original standard BS EN 62137-1-5-2009 in PDF full version. Additional info + preview on request
Document status: Active
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN. Original standard BS EN 62137-2004 (2005) in PDF full version. Additional info + preview on request
Document status: Withdrawn
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints. Original standard BS EN 62137-3-2012 in PDF full version. Additional info + preview on request
Document status: Active