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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines. Original standard PD IEC TR 61189-3-914-2017 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine- pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501. Original standard PD IEC TR 61189-5-506-2019 in PDF full version. Additional info + preview on request

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Printed board assemblies - Technical cleanliness of components and printed board assemblies. Original standard PD IEC TR 61191-7-2020 in PDF full version. Additional info + preview on request

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Printed board assemblies - Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices. Original standard PD IEC TR 61191-8-2021 in PDF full version. Additional info + preview on request

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Printed board assemblies - Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices. Original standard PD IEC TR 61191-9-2023 in PDF full version. Additional info + preview on request

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Live working. Voltage detectors - Guidelines on non-contact voltage detectors (NCVD) for use at nominal voltages above 1 kV AC. Original standard PD IEC TR 61243-6-2017 in PDF full version. Additional info + preview on request

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