STB PDF
Mechanical standardization of semiconductor devices - Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). Original standard UNE-EN 60191-6-13-2016 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA). Original standard UNE-EN 60191-6-18-2010 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage. Original standard UNE-EN 60191-6-19-2010 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP). Original standard UNE-EN 60191-6-21-2010 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA). Original standard UNE-EN 60191-6-4-2003 in PDF full version. Additional info + preview on request
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Method of measurement of current noise generated in fixed resistors. Original standard UNE-EN 60195-2016 in PDF full version. Additional info + preview on request
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