STB PDF
Semiconductor devices. Mechanical and climatic test methods - Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat. Original standard UNE-EN 60749-20-1-2009 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat. Original standard UNE-EN 60749-20-2009 in PDF full version. Additional info + preview on request
Document status: Replaced by STB UNE-EN IEC 60749-20-2020
Semiconductor devices. Mechanical and climatic test methods - Solderability. Original standard UNE-EN 60749-21-2011 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices. Mechanical and climatic test methods - Latch-up test. Original standard UNE-EN 60749-29-2011 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices. Mechanical and climatic test methods - Soft error test method for semiconductor devices with memory. Original standard UNE-EN 60749-38-2008 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices. Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components. Original standard UNE-EN 60749-39-2006 in PDF full version. Additional info + preview on request
Document status: Replaced by STB UNE-EN IEC 60749-39-2022