TDS PDF

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability. Original standard IPC JEDEC 9301-2018 in PDF full version. Additional info + preview on request

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Monotonic Bend Characterization of Board-Level Interconnects — Includes Addendum 1, May 2015; Modified August 2016. Original standard IPC JEDEC 9702-2004 (2016) in PDF full version. Additional info + preview on request

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Mechanical Shock Test Guidelines for Solder Joint Reliability — Reaffirmed May 2019. Original standard IPC JEDEC 9703-2009 (2019) in PDF full version. Additional info + preview on request

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Printed Circuit Assembly Strain Gage Test Guideline. Original standard IPC JEDEC 9704A-2012 in PDF full version. Additional info + preview on request

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Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection. Original standard IPC JEDEC 9706-2013 in PDF full version. Additional info + preview on request

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Spherical Bend Test Method for Characterization of Board Level Interconnects. Original standard IPC JEDEC 9707-2011 in PDF full version. Additional info + preview on request

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