IEC TS 62647-1-2012 PDF

Full title and description

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan. This Technical Specification defines objectives and requirements for documenting processes that demonstrate aerospace and defence electronic systems containing Pb-free solder, piece parts and printed wiring boards (PWBs) meet performance, reliability, airworthiness, safety and certifiability requirements over the specified life of the product.

Abstract

IEC/TS 62647-1:2012 specifies the objectives of, and requirements for, a Lead‑free Control Plan (LFCP) and for documenting processes that assure customers and regulators that avionics and defence electronic systems containing lead‑free solder will satisfy applicable performance, reliability, airworthiness, safety and certification requirements. The document includes technical and administrative plan requirements plus informative annexes with templates and guidance.

General information

• Status: Current / Active.
• Publication date: 9 August 2012.
• Publisher: International Electrotechnical Commission (IEC).
• ICS / categories: 03.100.50 (Production. Production management); 31.020 (Electronic components in general); 49.060 (Aerospace electric equipment and systems).
• Edition / version: Edition 1.0 (2012).
• Number of pages: 32.

Key bibliographic and status details are recorded in the IEC publication record for IEC/TS 62647-1:2012.

Scope

This Technical Specification applies to aerospace, defence and other high‑reliability electronic systems that contain lead‑free (Pb‑free) solder, Pb‑free piece parts, or PWBs. It establishes the objectives and mandatory requirements for preparing and documenting a Lead‑free Control Plan to ensure that products meet specified performance, reliability, airworthiness and safety requirements for their intended life. Informative annexes provide tailoring templates, a requirements matrix and guidance on configuration control and product identification.

Key topics and requirements

• Definition of objectives and scope for a Lead‑free Control Plan (LFCP).
• Technical requirements addressing Pb‑free solder, finishes and related materials affecting reliability and safety.
• Plan administrative requirements (documentation, responsibilities, traceability, configuration control).
• Templates for tailoring LFCP requirements to programme/product needs (informative annex).
• Requirements matrix for mapping plan content to technical and administrative clauses.
• Guidance on configuration control, product identification and change management.
• Terms, definitions and normative references relevant to lead‑free management in avionics.

Typical use and users

Used by avionics and defence prime contractors, suppliers of electronic assemblies and PWBs, quality and reliability engineers, procurement and supply‑chain managers, certification and airworthiness authorities, and programme managers who must document and demonstrate control of Pb‑free solder and related materials for safety‑critical electronic systems.

Related standards

IEC/TS 62647-1:2012 replaces the earlier IEC/PAS 62647-1:2011 (Lead‑free management). It is one part of the IEC 62647 series; another directly related part is IEC/TS 62647-2:2012 (Mitigation of deleterious effects of tin). For avionics programme compliance, users commonly align LFCP content with applicable aerospace certification and environmental standards.

Keywords

Lead‑free solder; lead‑free control plan; LFCP; avionics; aerospace; defence electronics; tin mitigation; reliability; airworthiness; configuration control.

FAQ

Q: What is this standard?

A: IEC/TS 62647-1:2012 is a Technical Specification that defines requirements and documentation practices for a Lead‑free Control Plan for aerospace and defence electronic systems containing Pb‑free solder.

Q: What does it cover?

A: It covers objectives, technical and administrative requirements for preparing and maintaining a Lead‑free Control Plan, including templates, a requirements matrix and guidance on configuration control and product identification to support performance, reliability, airworthiness and safety over product life.

Q: Who typically uses it?

A: Avionics and defence OEMs and suppliers, quality and reliability engineers, procurement and supply‑chain personnel, and certification/airworthiness assessors involved with high‑reliability electronic products that may use Pb‑free solder or finishes.

Q: Is it current or superseded?

A: IEC/TS 62647-1:2012 is the published Technical Specification (edition 1.0, 9 August 2012). It replaced IEC/PAS 62647-1:2011; users should check national bodies or the IEC catalogue for any later revisions or stability/sunset dates.

Q: Is it part of a series?

A: Yes — it is Part 1 of the IEC 62647 series addressing process management for avionics and lead‑free solder; Part 2 (IEC/TS 62647-2:2012) addresses mitigation of deleterious effects of tin.

Q: What are the key keywords?

A: Lead‑free control plan, Pb‑free solder, avionics, aerospace electronics, reliability, airworthiness, tin mitigation, configuration control.